|  Silicon Wafer Thickness Sensor (SIT-200)
SIT-200 Features
The SIT-200 uses a high-speed swept tunable laser, as opposed to a broadband source, to probe the wafer under test. This enables higher-power measurement per wavelength, leading to high dynamic range. As a result, thickness measurements can be performed even on un-polished wafers, for example during/after wet-etching.- All-Optical, non-contact thickness sensor for silicon wafers
- High dynamic range capable of measuring disordered surfaces
- Capable of in-situ measurement during wet-etching
SIT-200 Applications- Silicon Wafer Thickness Measurement
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 Updating... Ċ Jason Lin, 2016年7月27日 下午9:21
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