SIT-200

CMT PLANAR 804/1







Silicon Wafer Thickness Sensor (SIT-200)


SIT-200 Features

The SIT-200 uses a high-speed swept tunable laser, as opposed to a broadband source, to probe the wafer under test. This enables higher-power measurement per wavelength, leading to high dynamic range. As a result, thickness measurements can be performed even on un-polished wafers, for example during/after wet-etching.
  • All-Optical, non-contact thickness sensor for silicon wafers
  • High dynamic range capable of measuring disordered surfaces
  • Capable of in-situ measurement during wet-etching
SIT-200 Applications
  • Silicon Wafer Thickness Measurement

     

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Jason Lin,
2016年7月27日 下午9:21
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